Granted Patent
Utility
US 6,693,358
· Confirmation No. 8982
SEMICONDUCTOR CHIP, WIRING BOARD AND MANUFACTURING PROCESS THEREOF AS WELL AS SEMICONDUCTOR DEVICE
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2020-06-11 | OATH |
Oath or Declaration filed | 262 | View | |
| 2003-08-26 | IFEE |
Issue Fee Payment (PTO-85B) | 1 | View | |
| 2003-08-26 | IDS |
Information Disclosure Statement (IDS) Form (SB08) | 5 | View | |
| 2003-08-26 | FOR |
Foreign Reference | 11 | View | |
| 2003-08-26 | FOR |
Foreign Reference | 15 | View | |
| 2003-08-26 | FOR |
Foreign Reference | 116 | View | |
| 2001-10-10 | TRNA |
Transmittal of New Application | 4 | View | |
| 2001-10-10 | A.PE |
Preliminary Amendment | 4 | View | |
| 2001-10-10 | SPEC |
Specification | 128 | View | |
| 2001-10-10 | CLM |
Claims | 15 | View | |
| 2001-10-10 | ABST |
Abstract | 1 | View | |
| 2001-10-10 | DRW |
Drawings-only black and white line drawings | 70 | View | |
| 2001-10-10 | OATH |
Oath or Declaration filed | 3 | View |
Inventors
Yuichiro Yamada
Kyoto-shi, JAPAN
Tsuyoshi Hamatani
Ohtsu-shi, JAPAN
Attorneys & Agents of Record
Classification
USPC
257/774
H10W90/00
H10D62/117
H10W20/0245
H10W90/732
H10W72/552
H10W20/20
H10W72/834
H10W90/297
H10W90/724
H10W90/754
H10W72/5522
H10W20/023
H10W90/722
H10W72/5524
H10W72/5525
Prosecution
- Examiner
- ANDUJAR, LEONARDO
- Art Unit
- 2826
- Docket No.
- L8462.01108
- Confirmation No.
- 8982
Foreign Priority
2000-322908
·
2000-10-23
·
JAPAN
2000-331833
·
2000-10-31
·
JAPAN
2000-350976
·
2000-11-17
·
JAPAN
2000-350977
·
2000-11-17
·
JAPAN
Publication
- Pub. No.
- US20020047210A1
- Pub. Date
- 2002-04-25
Patent Term Adjustment
-41days
TESSERA, INC.,
INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.),
FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS),
INVENSAS CORPORATION,
TESSERA ADVANCED TECHNOLOGIES, INC,
DTS, INC.,
DTS LLC,
PHORUS, INC.,
IBIQUITY DIGITAL CORPORATION
from
ROYAL BANK OF CANADA
RELEASE OF SECURITY INTEREST
Recorded 2020-06-11
from
DTS, INC.,
IBIQUITY DIGITAL CORPORATION,
INVENSAS BONDING TECHNOLOGIES, INC.,
INVENSAS CORPORATION,
PHORUS, INC.,
ROVI GUIDES, INC.,
ROVI SOLUTIONS CORPORATION,
ROVI TECHNOLOGIES CORPORATION,
TESSERA ADVANCED TECHNOLOGIES, INC.,
TESSERA, INC.,
TIVO SOLUTIONS INC.,
VEVEO, INC.
SECURITY INTEREST
Recorded 2020-06-01
from
DIGITALOPTICS CORPORATION,
DIGITALOPTICS CORPORATION MEMS,
DTS, INC.,
DTS, LLC,
IBIQUITY DIGITAL CORPORATION,
INVENSAS CORPORATION,
PHORUS, INC.,
TESSERA ADVANCED TECHNOLOGIES, INC.,
TESSERA, INC.,
ZIPTRONIX, INC.
SECURITY INTEREST
Recorded 2016-12-02
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2014-10-27
CHANGE OF NAME
Recorded 2013-12-04
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-10-10
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Quick Facts
- Patent No.
- US 6,693,358
- App. No.
- 09/972,884
- Filed
- 2001-10-10
- Granted
- 2004-02-17
- Pub. No.
- US20020047210A1
- Examiner
- ANDUJAR, LEONARDO
- Art Unit
- 2826
- PTA
- -41 days
External Links