Patent Assignment
Reel/Frame 031765/0415
Change of Name
Recorded: 2013-12-04
Pages: 4
Assignor
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Executed: 2008-10-01
Assignee
PANASONIC CORPORATION
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Properties
(4)
Method of Making a Semiconductor Device Including Testing Before Thinning the Semiconductor Substrate
Patent:
6,365,513 →
Application:
09/162,232 →
Semiconductor Device and Method of Producing the Same
Patent:
6,534,874 →
Application:
09/688,816 →
Semiconductor Chip, Wiring Board and Manufacturing Process Thereof as Well as Semiconductor Device
Semiconductor Chip, Wiring Board and Manufacturing Process Thereof as Well as Semiconductor Device
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 29, 1998
From: FURUKAWA, HIDETOSHI; NOMA, ATSUSHI; TANAKA, TSUYOSHI; ISHIDA, HIDETOSHI
To: MATSUSHITA ELECTRONICS CORPORATION
Reel/Frame 009496/0393 →
Assignment of Assignor's Interest
Oct 17, 2000
From: MATSUMURA, KAZUHIKO
To: MATSUSHITA ELECTRONICS CORPORATION
Reel/Frame 011237/0010 →
Merger
Jun 5, 2001
From: MATSUSHITA ELECTRONICS CORPORATION
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 011862/0901 →
Assignment of Assignor's Interest
Jun 7, 2001
From: MATSUSHITA ELECTRONICS CORPORATION
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 011855/0674 →
Assignment of Assignor's Interest
Oct 10, 2001
From: YAMADA, YUICHIRO; HAMATANI, TSUYOSHI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 012254/0574 →
Assignment of Assignor's Interest
Oct 27, 2014
From: PANASONIC CORPORATION
To: INVENSAS CORPORATION
Reel/Frame 034042/0112 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →