Patent Assignment
Reel/Frame 009597/0141
Assignment of Assignor's Interest
Recorded: 1998-11-19
Pages: 2
Assignor
RHA, KWA GOO
Executed: 1998-10-26
Assignee
LG SEMICON CO., LTD.
CHEONGJU-SI, 1, HYANGJEONG-DONG, HEUNGDUK-KU, CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Trench Isolation Structure and Fabrication Method Thereof
Patent:
6,127,241 →
Application:
09/195,558 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Aug 15, 2000
From: LG SEMICON CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 011049/0271 →
Assignment of Assignor's Interest
Mar 9, 2014
From: SK HYNIX INC
To: INTELLECTUAL DISCOVERY CO., LTD.
Reel/Frame 032421/0488 →
Change of Name
Mar 9, 2014
From: HYNIX SEMICONDUCTOR, INC.
To: SK HYNIX INC
Reel/Frame 032421/0496 →
Change of Name
Mar 9, 2014
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR, INC.
Reel/Frame 032421/0637 →