Patent Assignment
Reel/Frame 011049/0271
Merger
Recorded: 2000-08-15
Pages: 15
Assignor
LG SEMICON CO., LTD.
Executed: 1999-10-20
Assignee
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
SAN 136-1, AMI-RI, PUBAL-UP, ICHON-SHI, KOREA, REPUBLIC OF
Covered Property
(1)
Trench Isolation Structure and Fabrication Method Thereof
Patent:
6,127,241 →
Application:
09/195,558 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 19, 1998
From: RHA, KWA GOO
To: LG SEMICON CO., LTD.
Reel/Frame 009597/0141 →
Assignment of Assignor's Interest
Mar 9, 2014
From: SK HYNIX INC
To: INTELLECTUAL DISCOVERY CO., LTD.
Reel/Frame 032421/0488 →
Change of Name
Mar 9, 2014
From: HYNIX SEMICONDUCTOR, INC.
To: SK HYNIX INC
Reel/Frame 032421/0496 →
Change of Name
Mar 9, 2014
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR, INC.
Reel/Frame 032421/0637 →