Assignment of Assignor's Interest

Recorded: 1999-09-24 Pages: 2

Assignors

TANAHASHI, AKIRA

Executed: 1999-07-29

SHIBATA, SEIJI

Executed: 1999-08-23

IMAIZUMI, NORIHISA

Executed: 1999-08-04

SUDO, EIICHI

Executed: 1999-09-02

Assignees

DENSO CORPORATION

1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN

TAMURA KAKEN CORPORATION

16-2, SAYAMAGAHARA, IRUMA-SHI, SAITAMA, 358-8501, JAPAN

Covered Property (1)

Soldering Paste, Soldering Method, and Surface-Mounted Type Electronic Device

Patent: 6,488,781 →

Application: 09/384,226 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.