IP Library › Assignment 026268/0344
Patent Assignment
Reel/Frame 026268/0344

Merger

Recorded: 2011-05-12 Pages: 19
Assignor
TAMURA KAKEN CORPORATION
Executed: 2010-04-01
Assignee
TAMURA CORPORATION
1-19-43, HIGASHI-OIZUMI, NERIMA-KU, TOKYO, 178-8511, JAPAN
Covered Properties (2)
Soldering Paste, Soldering Method, and Surface-Mounted Type Electronic Device
Patent: 6,488,781 →
Application: 09/384,226 →
Solder Work Material for Forming Solder-Coated Circuit Board and Circuit Board
Patent: 6,790,293 →
Application: 10/147,171 →
Publication: US 2002/0195170
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 24, 1999
From: TANAHASHI, AKIRA; SHIBATA, SEIJI; IMAIZUMI, NORIHISA; SUDO, EIICHI
To: DENSO CORPORATION; TAMURA KAKEN CORPORATION
Reel/Frame 010265/0072 →
Assignment of Assignor's Interest Aug 6, 2002
From: NOMURA, MASAHIRO; OGA, TOSHIYUKI; GIDO, TAKANOBU; ONO, TAKAO
To: NEC CORPORATION; TAMURAKAKEN CORPORATION
Reel/Frame 012959/0536 →