IP Library Assignment 012959/0536
Patent Assignment
Reel/Frame 012959/0536

Assignment of Assignor's Interest

Recorded: 2002-08-06 Pages: 4
Assignors
NOMURA, MASAHIRO
Executed: 2002-04-23
OGA, TOSHIYUKI
Executed: 2002-04-23
GIDO, TAKANOBU
Executed: 2002-04-23
ONO, TAKAO
Executed: 2002-04-23
TAKAHASHI, YOSHIYUKI
Executed: 2002-04-23
SASAKI, RIKA
Executed: 2002-05-11
Assignees
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
TAMURAKAKEN CORPORATION
IRUMA-SHI, 16-2, OAZA SAYAMAGAHARA, SAITAMA, 358-8, JAPAN
Covered Property (1)
Solder Work Material for Forming Solder-Coated Circuit Board and Circuit Board
Patent: 6,790,293 →
Application: 10/147,171 →
Publication: US 2002/0195170
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger May 12, 2011
From: TAMURA KAKEN CORPORATION
To: TAMURA CORPORATION
Reel/Frame 026268/0344 →