Patent Assignment
Reel/Frame 011546/0064
Assignment of Assignor's Interest
Recorded: 2001-02-20
Pages: 4
Assignor
YANG, JUN YOUNG
Executed: 2001-01-10
Assignee
AMKOR TECHNOLOGY, INC.
1900 S. PRICE ROAD, CHANDLER, ARIZONA, 85248
Covered Property
(1)
Semiconductor Package Having Improved Adhesiveness and Ground Bonding
Patent:
6,853,059 →
Application:
09/687,493 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 12, 2001
From: JANG, SUNG SIK
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 011978/0833 →
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →