Patent Assignment
Reel/Frame 011566/0804
Assignment of Assignor's Interest
Recorded: 2001-02-28
Pages: 6
Assignor
STELLEX MICROWAVE SYSTEMS, INC.
Executed: 2001-02-02
Assignee
M/A COM TECH, INC.
1011 PAWTUCKET BLVD., LOWELL, MASSACHUSETTS, 01853
Covered Properties
(3)
Microwave Notch Filter Using Pin Diode Shunted Yig Resonators
Patent:
4,965,539 →
Application:
07/360,312 →
Apparatus for Low Stress Polishing of Spherical Objects
Patent:
4,965,967 →
Application:
07/455,182 →
Ferromagnetic Tuning Ring for Yig Oscillators
Patent:
6,201,449 →
Application:
09/360,807 →
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Jun 2, 1989
From: KORBER, MARINUS L. JR.
To: WATKINS-JOHNSON COMPANY
Reel/Frame 005089/0420 →
Assignment of Assignors Interest.
Dec 22, 1989
From: LONDON, CHRISTOPHER L.
To: WATKINS-JOHNSON COMPANY, A CORP. OF CA
Reel/Frame 005205/0017 →
Assignment of Assignor's Interest
Nov 13, 1997
From: WATKINS-JOHNSON COMPANY, A CALIFORNIA CORPORATION
To: STELLEX MICROWAVE SYSTEMS, INC., A CALIFORNIA CORPORATION
Reel/Frame 008811/0760 →
Security Interest
Nov 14, 1997
From: STELLEX MICROWAVE SYSTEMS, INC.
To: FIRST UNION COMMERCIAL CORPORATION
Reel/Frame 008829/0085 →
Assignment of Assignor's Interest
Aug 30, 1999
From: KORBER, MARINUS L., JR.
To: STELLEX MICROWAVE SYSTEMS, INC.
Reel/Frame 010204/0610 →
Release
Feb 27, 2001
From: FIRST UNION COMMERCIAL CORPORATION, AS COLLATERAL AGENT
To: STELLEX MICROWAVE SYSTEMS, INC.
Reel/Frame 011855/0294 →
Assignment of Assignor's Interest
Jun 11, 2001
From: M/A COM TECH, INC.
To: TYCO ELECTRONICS LOGISTICS AG
Reel/Frame 011887/0173 →
Assignment of Assignor's Interest
Jun 24, 2002
From: TYCO ELECTRONICS LOGISTICS, A.G.
To: ENDWAVE CORPORATION
Reel/Frame 013019/0416 →
Assignment of Assignor's Interest
Jul 8, 2009
From: ENDWAVE CORPORATION
To: MICROSEMI CORPORATION
Reel/Frame 022917/0702 →
Patent Security Agreement
Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →
Release of Security Interest
Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION
Reel/Frame 037558/0711 →
Amended and Restated Intellectual Property Security Agreement
Apr 6, 2016
From: ENDWAVE CORPORATION
To: SILICON VALLEY BANK
Reel/Frame 038372/0393 →
Release of Security Interest
Apr 5, 2017
From: SILICON VALLEY BANK
To: ENDWAVE CORPORATION
Reel/Frame 042166/0194 →