IP Library Assignment 042166/0194
Patent Assignment
Reel/Frame 042166/0194

Release of Security Interest

Recorded: 2017-04-05 Pages: 7
Assignor
SILICON VALLEY BANK
Executed: 2017-04-04
Assignee
ENDWAVE CORPORATION
130 BAVTECH DRIVE, SAN JOSE, CALIFORNIA, 95134
Covered Properties (53)
Microwave Notch Filter Using Pin Diode Shunted Yig Resonators
Patent: 4,965,539 →
Application: 07/360,312 →
Apparatus for Low Stress Polishing of Spherical Objects
Patent: 4,965,967 →
Application: 07/455,182 →
Dual-Sided Push-Pull Amplifier
Patent: 5,491,449 →
Application: 08/155,030 →
Method of Making a Hybrid Circuit with a Chip Having Active Devices with Extra-Chip Interconnections
Patent: 5,698,469 →
Application: 08/400,025 →
Coplanar Waveguide-Mounted Flip Chip
Patent: 5,528,203 →
Application: 08/478,375 →
Reentrant Power Coupler
Patent: 5,563,558 →
Application: 08/505,789 →
Sectorized Multi-Function Communication System
Patent: 5,771,449 →
Application: 08/519,476 →
Push-Pull Power Amplifier
Patent: 5,623,231 →
Application: 08/555,131 →
Slot Line to Cpw Circuit Structure
Patent: 5,610,563 →
Application: 08/555,493 →
Vareactor with Electrostatic Barrier
Patent: 5,789,801 →
Application: 08/555,777 →
Coplanar Waveguide-Mounted Flip Chip Having Coupled Ground Conductors
Patent: 5,668,512 →
Application: 08/662,693 →
Structure and Method of Suppressing Undesired Modes in Coplanar Microwave Circuit Having Suppression of Undersired Modes
Patent: 6,023,209 →
Application: 08/675,931 →
Coplanar Mixer Assembly
Patent: 5,832,376 →
Application: 08/679,259 →
Circuit Structure Having a Matrix of Active Devices
Patent: 5,942,804 →
Application: 08/697,927 →
Coplanar Waveguide Strip Band Pass Filter
Patent: 5,770,987 →
Application: 08/709,274 →
Miniature Active Conversion Between Slotline and Coplanar Waveguide
Patent: 5,821,815 →
Application: 08/719,860 →
Slotline-Mounted Flip Chip Structures
Patent: 5,978,666 →
Application: 08/725,962 →
Slotline-Mounted Flip Chip
Patent: 5,983,089 →
Application: 08/725,972 →
Coplanar Waveguide Amplifier
Patent: 5,760,650 →
Application: 08/731,196 →
Coplanar Oscillator Circuit Structures
Patent: 5,821,827 →
Application: 08/769,144 →
Miniature Active Conversion Between Microstrip and Coplanar Wave Guide
Patent: 35,869 →
Application: 08/903,239 →
Flip-Mounted Impedance
Patent: 5,942,957 →
Application: 08/929,688 →
Transition Between Circuit Transmission Line and Microwave Waveguide `
Patent: 6,002,305 →
Application: 08/937,754 →
Slot Line Band Pass Filter
Patent: 6,023,206 →
Application: 08/943,268 →
Sectorized Multi-Function Communication System
Patent: 6,052,582 →
Application: 09/019,821 →
Multiple Stage Self-Biasing Rf Transistor Circuit
Patent: 6,064,253 →
Application: 09/063,425 →
Slotline-To Slotline Mounted Flip Chip
Patent: 6,094,114 →
Application: 09/136,431 →
Slot Line Band Reject Filter
Patent: 6,194,981 →
Application: 09/283,704 →
Coplanar Waveguide Filter
Patent: 6,034,580 →
Application: 09/298,812 →
Push-Pull Amplifier with Dual Coplanar Transmission Line
Patent: 6,265,937 →
Application: 09/323,438 →
Apparatus and Method for the Placement and Bonding of a Die on a Substrate
Patent: 6,640,423 →
Application: 09/618,324 →
Wireless Point to Multi-Point Communication Apparatus and Method
Patent: 7,006,794 →
Application: 09/625,065 →
Impedance-Compensating Circuit
Patent: 6,600,384 →
Application: 09/861,063 →
Publication: US 2002/0175777
Tunable resonator and method of tuning the same
Application: 09/911,183 →
Publication: US 2003/0016099
Waveguide mixer/coupler
Application: 09/946,972 →
Publication: US 2003/0045262
Imaging Device with Angle-Compensated Focus
Application: 10/010,527 →
Publication: US 2003/0103277
N-way signal divider
Application: 10/613,882 →
Publication: US 2004/0004522
Mounting with Auxiliary Bumps
Patent: 7,109,583 →
Application: 10/841,764 →
Publication: US 2005/0248031
Component Interconnect with Substrate Shielding
Patent: 7,411,279 →
Application: 10/882,378 →
Publication: US 2006/0001129
Multi-Subtrate Microstrip to Waveguide Transition
Patent: 7,276,988 →
Application: 10/882,885 →
Publication: US 2006/0001503
Electromagnetic shield assembly
Application: 10/882,886 →
Publication: US 2006/0002099
Chip-To-Chip Trench Circuit Structure
Patent: 7,348,666 →
Application: 10/883,356 →
Publication: US 2006/0001154
Transmission Line Orientation Transition
Patent: 7,145,414 →
Application: 10/883,401 →
Publication: US 2005/0030120
Compensated Interdigitated Coupler
Patent: 7,119,633 →
Application: 10/925,684 →
Publication: US 2006/0044073
Circuit Structure with Multifunction Circuit Cover
Patent: 7,813,145 →
Application: 11/692,129 →
Publication: US 2007/0190858
Compensated Attenuator
Application: 11/777,096 →
Publication: US 2009/0015355
Coaxial-To-Microstrip Transitions and Manufacturing Methods
Patent: 7,750,764 →
Application: 12/038,546 →
Publication: US 2009/0212881
Merged-Filter Multiplexer
Patent: 7,710,219 →
Application: 12/039,536 →
Publication: US 2009/0219110
Chip Mounting with Flowable Layer
Patent: 7,588,966 →
Application: 12/042,144 →
Publication: US 2008/0153206
Distributed Amplifier with Negative Feedback
Patent: 7,804,362 →
Application: 12/391,144 →
Publication: US 2009/0212869
Shaped reflector surface of microwave antenna
Patent: 453,925 →
Application: 29/138,686 →
Shaped reflector surface of a microwave antenna
Patent: 453,152 →
Application: 29/145,182 →
Shaped reflector surface of a microwave antenna
Patent: 453,927 →
Application: 29/145,183 →
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Amended and Restated Intellectual Property Security Agreement Apr 6, 2016
From: ENDWAVE CORPORATION
To: SILICON VALLEY BANK
Reel/Frame 038372/0393 →
Security Agreement Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
Assignment of Assignor's Interest Aug 4, 2017
From: ENDWAVE CORPORATION
To: INTEGRATED DEVICE TECHNOLOGY, INC.
Reel/Frame 043207/0542 →
Release of Security Interest Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION
Reel/Frame 048746/0001 →
Assignment of Assignor's Interest Jan 15, 2024
From: MASOR, LAURA L.
To: BALL HORTICULTURAL COMPANY
Reel/Frame 066121/0147 →