Patent Assignment
Reel/Frame 043207/0542
Assignment of Assignor's Interest
Recorded: 2017-08-04
Pages: 4
Assignor
ENDWAVE CORPORATION
Executed: 2017-08-04
Assignee
INTEGRATED DEVICE TECHNOLOGY, INC.
6024 SILVER CREEK VALLEY ROAD, SAN JOSE, CALIFORNIA, 95138
Covered Properties
(10)
Transition Between Circuit Transmission Line and Microwave Waveguide `
Patent:
6,002,305 →
Application:
08/937,754 →
Multiple Stage Self-Biasing Rf Transistor Circuit
Patent:
6,064,253 →
Application:
09/063,425 →
Impedance-Compensating Circuit
Mounting with Auxiliary Bumps
Multi-Subtrate Microstrip to Waveguide Transition
Chip-To-Chip Trench Circuit Structure
Transmission Line Orientation Transition
Compensated Interdigitated Coupler
Merged-Filter Multiplexer
Chip Mounting with Flowable Layer
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Amended and Restated Intellectual Property Security Agreement
Apr 6, 2016
From: ENDWAVE CORPORATION
To: SILICON VALLEY BANK
Reel/Frame 038372/0393 →
Release of Security Interest
Apr 5, 2017
From: SILICON VALLEY BANK
To: ENDWAVE CORPORATION
Reel/Frame 042166/0194 →
Security Agreement
Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
Release of Security Interest
Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION
Reel/Frame 048746/0001 →