Patent Assignment
Reel/Frame 011610/0093
Assignment of Assignor's Interest
Recorded: 2001-03-13
Pages: 3
Assignor
YANG, WENGE
Executed: 2001-03-01
Assignee
ADVANCED MICRO DEVICES, INC.
ONE AMD PLACE, SUNNYVALE, CALIFORNIA, 94088
Covered Property
(1)
A Method of Forming Highly Conductive Semiconductor Structures via Plasma Etch
Patent:
7,217,652 →
Application:
09/805,273 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 19, 2007
From: ADVANCED MICRO DEVICES, INC.
To: SPANSION INC.
Reel/Frame 019029/0976 →
Assignment of Assignor's Interest
Mar 22, 2007
From: SPANSION INC.
To: SPANSION LLC
Reel/Frame 019052/0748 →
Security Agreement
Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Release of Security Interest
Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
Security Interest
Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
Assignment of Assignor's Interest
Jun 30, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036038/0620 →
Corrective Assignment to Correct the 8647899 Previously Recorded on Reel 035240 Frame 0429. Assignor(S) Hereby Confirms the Security Interst.
Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →