Method of forming highly conductive semiconductor structures via plasma etch
View Patent ↗A process for making semiconductor structures uses a decoupled plasma source to produce a highly selective plasma etchant to form a structure with a thin adhesive layer and overlaying conductive layer. The preferred plasma is formed from chlorine and oxygen feed gases. The highly conductive semiconductor structure has a thickness less than about 3000 Å, preferably less than about 2600 Å, and incorporates an adhesive layer that is preferably less than about 100 Å thick. Despite the reduced profile and topography of the structure, it is more conductive than prior structures, and provides a robust device.
1. A process for making a semiconductor structure comprising:
depositing a conductive layer upon a substrate comprising a silicon oxide-silicon nitride-silicon oxide (ONO) layer;
depositing a conductive adhesive layer comprising polysilicon between said substrate and said conductive layer, wherein said conductive adhesive layer has a minimum thickness required to provide adhesion between said substrate and said conductive layer for a robust structure that can withstand subsequent processing, wherein said conductive adhesive layer has a thickness that is greater than 10 and less than or equal to 100 angstroms; and
etching a portion of said conductive layer and a portion of said conductive adhesive layer utilizing a plasma without sacrificing said substrate, wherein said plasma comprises an etchant, wherein said etchant comprises chlorine and oxygen, wherein said plasma is ionized and sustained by a first RF source, and wherein said plasma is accelerated by a second RF source, wherein said etching is conducted at a pressure of between 2 mTorr and 4 mTorr, wherein a selectivity of said etching obviates a need for an adhesive layer of greater than 100 angstrom thickness, and wherein said process yields a semiconductor structure comprising a lower electrical resistance and a shorter vertical profile than a semiconductor structure comprising a conductive adhesive layer of greater than 100 angstrom thickness.
2. The process of claim 1 , wherein said conductive layer and said conductive adhesive layer have a combined thickness of approximately 3000 angstroms or less.
3. The process of claim 1 , wherein
said conductive layer comprises a material selected from the group consisting of tungsten and tungsten silicide.
4. The process of claim 1 , wherein a flow rate of said chlorine is approximately 40 to 100 sccm.
5. The process of claim 1 , wherein a flow rate of said oxygen is approximately 4 to 12 sccm.
6. The process of claim 1 , wherein said first RF source is approximately 800 to 1500 watts.
7. The process of claim 1 , wherein said second RF source is approximately 50 to 150 watts.