Patent Assignment
Reel/Frame 011655/0522
Assignment of Assignor's Interest
Recorded: 2001-03-26
Pages: 3
Assignor
XIANG, QI
Executed: 2001-03-22
Assignee
ADVANCED MICRO DEVICES, INC.
P.O. BOX 3453, ONE AMD PLACE, SUNNYVALE, CALIFORNIA, 94088
Covered Property
(1)
Low Density, Tensile Stress Reducing Material for Sti Trench Fill
Patent:
6,583,488 →
Application:
09/817,858 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Affirmation of Patent Assignment
Aug 18, 2009
From: ADVANCED MICRO DEVICES, INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 023119/0083 →
Security Agreement
Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Assignment of Assignor's Interest
Nov 2, 2020
From: GLOBALFOUNDRIES INC.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 054633/0001 →
Release of Security Interest
Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →
Release of Security Interest
May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →