Patent Assignment
Reel/Frame 011841/0834
Assignment of Assignor's Interest
Recorded: 2001-05-29
Pages: 4
Assignees
INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC, VZW), A BELGIUM CORPORATION
KAPELDREEF 75, B-3001 LEUVEN, BELGIUM
CIMULEC, A FRANCE CORPORATION
CHARLES PICARD, 57365 ENNERY, FRANCE
Covered Property
(1)
Method for Fabricating a Thin Film Build-Up Structure on a Sequentially Laminated Printed Circuit Board Base
Patent:
6,711,813 →
Application:
09/707,311 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Transfer of Ownership and License Agreement
Nov 28, 2003
From: CIMULEC, A FRENCH CORPORATION
To: INTERUNIVERSITAIR MICROELEKTRONIC CENTRUM (IMEC, VZW), A BELGIAN CORPORATION
Reel/Frame 014732/0583 →
Change of Name
Oct 26, 2009
From: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC VZW), A BELGIUM CORPORATION
To: IMEC
Reel/Frame 023419/0154 →