Patent Assignment
Reel/Frame 014732/0583
Transfer of Ownership and License Agreement
Recorded: 2003-11-28
Pages: 6
Assignor
CIMULEC, A FRENCH CORPORATION
Executed: 2003-07-25
Assignee
INTERUNIVERSITAIR MICROELEKTRONIC CENTRUM (IMEC, VZW), A BELGIAN CORPORATION
KAPELDREEF 75, B-3001 LEUVEN, BELGIUM
Covered Property
(1)
Method for Fabricating a Thin Film Build-Up Structure on a Sequentially Laminated Printed Circuit Board Base
Patent:
6,711,813 →
Application:
09/707,311 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 29, 2001
From: BEYNE, ERIC; LECHLEITER, FRANCOIS
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC, VZW), A BELGIUM CORPORATION; CIMULEC, A FRANCE CORPORATION
Reel/Frame 011841/0834 →
Change of Name
Oct 26, 2009
From: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC VZW), A BELGIUM CORPORATION
To: IMEC
Reel/Frame 023419/0154 →