Patent Assignment
Reel/Frame 011891/0898
Assignment of Assignor's Interest
Recorded: 2001-06-11
Pages: 3
Assignor
SAITO, HIROFUMI
Executed: 2001-06-01
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method of Fabrication of Multilayersemiconductor Wiring Structure with Reduced Alignment Mark Area
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.