Patent Assignment
Reel/Frame 013791/0437
Assignment of Assignor's Interest
Recorded: 2003-02-27
Pages: 8
Assignor
NEC CORPORATION
Executed: 2002-11-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Method of Fabrication of Multilayersemiconductor Wiring Structure with Reduced Alignment Mark Area
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.