IP Library Assignment 012018/0279
Patent Assignment
Reel/Frame 012018/0279

Assignment of Assignor's Interest

Recorded: 2001-07-23 Pages: 3
Assignor
USAMI, TATSUYA
Executed: 2001-07-17
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
A Method of Manufacturing a Multi-Level Interconnection Structure
Patent: 6,514,852 →
Application: 09/910,994 →
Publication: US 2002/0009873
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 19, 2003
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013736/0321 →
Change of Name Dec 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025486/0443 →