Patent Application
Utility
App. No. 09/910,994
· Confirmation No. 3525
A METHOD OF MANUFACTURING A MULTI-LEVEL INTERCONNECTION STRUCTURE
Inventor:
Tatsuya Usami
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-07-23 | TRNA |
Transmittal of New Application | 1 | View | |
| 2001-07-23 | SPEC |
Specification | 23 | View | |
| 2001-07-23 | CLM |
Claims | 4 | View | |
| 2001-07-23 | ABST |
Abstract | 1 | View | |
| 2001-07-23 | DRW |
Drawings-only black and white line drawings | 22 | View | |
| 2001-07-23 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
Tatsuya Usami
Tokyo, JAPAN
Attorneys & Agents of Record
Classification
USPC
438/624
H10W20/071
H10P50/73
H10W20/088
H10W20/087
H10W20/0888
H10W20/075
Prosecution
- Examiner
- LEE, HSIEN MING
- Art Unit
- 2814
- Customer No.
- 27667
- Docket No.
- NEC 01207
- Confirmation No.
- 3525
Foreign Priority
2000-222414
·
2000-07-24
·
JAPAN
Publication
- Pub. No.
- US20020009873A1
- Pub. Date
- 2002-01-24
Patent Term Adjustment
-7days
from
NEC CORPORATION
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2003-02-19
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Quick Facts
- App. No.
- 09/910,994
- Filed
- 2001-07-23
- Granted
- 2003-02-04
- Pub. No.
- US20020009873A1
- Examiner
- LEE, HSIEN MING
- Art Unit
- 2814
- PTA
- -7 days
External Links