Patent Assignment
Reel/Frame 012021/0816
Assignment of Assignor's Interest
Recorded: 2001-07-24
Pages: 2
Assignors
YASUI, KAN
Executed: 2001-06-27
KATAGIRI, SOUICHI
Executed: 2001-06-27
NAGASAWA, MASAYUKI
Executed: 2001-06-27
YAMAGUCHI, UI
Executed: 2001-06-27
KAWAMURA, YOSHIO
Executed: 2001-07-05
Assignee
HITACHI, LTD.
6, KANDA SURUGADAL 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Planarizing Method of Semiconductor Wafer and Apparatus Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 1, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014573/0096 →
Assignment of Assignor's Interest
Nov 28, 2006
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 018559/0281 →
Merger
May 11, 2011
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026326/0102 →