IP Library › Assignment 012091/0147
Patent Assignment
Reel/Frame 012091/0147

Assignment of Assignor's Interest

Recorded: 2001-08-21 Pages: 2
Assignor
LEE, KANG-YOUL
Executed: 2001-06-28
Assignee
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Multi-Level Bonding Option Circuit
Patent: 6,411,127 →
Application: 09/855,522 →
Publication: US 2001/0052795
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 9, 2014
From: SK HYNIX INC
To: INTELLECTUAL DISCOVERY CO., LTD.
Reel/Frame 032421/0488 →
Change of Name Mar 9, 2014
From: HYNIX SEMICONDUCTOR, INC.
To: SK HYNIX INC
Reel/Frame 032421/0496 →
Change of Name Mar 9, 2014
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR, INC.
Reel/Frame 032421/0637 →