IP Library Granted Patent US 6,411,127
Granted Patent Utility
US 6,411,127 · Confirmation No. 9760

MULTI-LEVEL BONDING OPTION CIRCUIT

Inventor: Kang-Youl Lee
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Code Description Pages PDF
2005-06-02 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2001-05-16 TRNA Transmittal of New Application 1 View
2001-05-16 SPEC Specification 18 View
2001-05-16 CLM Claims 15 View
2001-05-16 ABST Abstract 1 View
2001-05-16 DRW Drawings-only black and white line drawings 5 View
2001-05-16 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,411,127
App. No.
09/855,522
Filed
2001-05-16
Granted
2002-06-25
Pub. No.
US20010052795A1
Examiner
TAN, VIBOL
Art Unit
2819
PTA
-98 days