IP Library › Assignment 012138/0941
Patent Assignment
Reel/Frame 012138/0941

Assignment of Assignor's Interest

Recorded: 2001-08-30 Pages: 3
Assignors
KURIHARA, TOSHIMICHI
Executed: 2001-08-27
UEDA, TAKASHI
Executed: 2001-08-27
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Device in a Resin Sealed Package with a Radiating Plate and Manufacturing Method Thereof
Patent: 7,429,791 →
Application: 09/942,445 →
Publication: US 2002/0025606
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 29, 2002
From: NEC CORPORATION
To: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Reel/Frame 013434/0575 →
Assignment of Assignor's Interest Mar 30, 2006
From: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017693/0285 →
Change of Name Dec 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025486/0443 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →