Patent Assignment
Reel/Frame 013434/0575
Assignment of Assignor's Interest
Recorded: 2002-10-29
Pages: 3
Assignor
NEC CORPORATION
Executed: 2002-10-16
Assignee
NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
1753, SHIMONUMABE, NAKAHARA-KU KAWASAKI-SHI, KANAGAWA, 211-8666, JAPAN
Covered Properties
(2)
Semiconductor Device in a Resin Sealed Package with a Radiating Plate and Manufacturing Method Thereof
Semiconductor device and method for fabricating same
Application:
10/112,189 →
Publication:
US 2002/0139971
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 30, 2001
From: KURIHARA, TOSHIMICHI; UEDA, TAKASHI
To: NEC CORPORATION
Reel/Frame 012138/0941 →
Assignment of Assignor's Interest
Mar 29, 2002
From: EDA, TSUYOSHI
To: NEC CORPORATION
Reel/Frame 012755/0643 →
Assignment of Assignor's Interest
Mar 30, 2006
From: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017693/0285 →
Change of Name
Dec 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025486/0443 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →