IP Library › Assignment 017693/0285
Patent Assignment
Reel/Frame 017693/0285

Assignment of Assignor's Interest

Recorded: 2006-03-30 Pages: 2
Assignor
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Semiconductor Device in a Resin Sealed Package with a Radiating Plate and Manufacturing Method Thereof
Patent: 7,429,791 →
Application: 09/942,445 →
Publication: US 2002/0025606
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 30, 2001
From: KURIHARA, TOSHIMICHI; UEDA, TAKASHI
To: NEC CORPORATION
Reel/Frame 012138/0941 →
Assignment of Assignor's Interest Oct 29, 2002
From: NEC CORPORATION
To: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Reel/Frame 013434/0575 →
Change of Name Dec 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025486/0443 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →