IP Library › Assignment 012196/0681
Patent Assignment
Reel/Frame 012196/0681

Assignment of Assignor's Interest

Recorded: 2001-09-20 Pages: 3
Assignors
ROETERS, GLEN E.
Executed: 2001-09-13
MANTZ, FRANK E.
Executed: 2001-09-14
Assignee
DENSE-PAC MICROSYSTEMS
7321 LINCOLN WAY, GARDEN GROVE, CALIFORNIA, 92841
Covered Property (1)
Post in Ring Interconnect Using for 3-D Stacking
Patent: 6,573,460 →
Application: 09/957,190 →
Publication: US 2003/0051906
Related Assignments (7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 25, 2004
From: DPAC TECHNOLOGIES CORP. (FORMERLY KNOWN AS DENSE-PAC MICROSYSTEMS, INC.)
To: STAKTEK GROUP L.P.
Reel/Frame 015530/0449 →
Change of Name Jan 26, 2010
From: STAKTEK GROUP, L.P.
To: ENTORIAN TECHNOLOGIES L.P.
Reel/Frame 023848/0062 →
Merger Oct 25, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029195/0048 →
Merger Oct 25, 2012
From: ENTORIAN GP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029195/0114 →
Assignment of Assignor's Interest Dec 2, 2012
From: ENTORIAN TECHNOLOGIES INC.
To: OVID DATA CO. LLC
Reel/Frame 029389/0672 →
Change of Name Dec 2, 2012
From: DENSE-PAC MICROSYSTEMS, INC.
To: DPAC TECHNOLOGIES CORP.
Reel/Frame 029395/0945 →
Merger Dec 27, 2015
From: OVID DATA CO. LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037373/0481 →