Patent Assignment
Reel/Frame 015530/0449
Assignment of Assignor's Interest
Recorded: 2004-06-25
Pages: 22
Assignor
DPAC TECHNOLOGIES CORP. (FORMERLY KNOWN AS DENSE-PAC MICROSYSTEMS, INC.)
Executed: 2004-06-09
Assignee
STAKTEK GROUP L.P.
8900 SHOAL CREEK BLVD., SUITE 125, AUSTIN, TEXAS, 78757
Covered Property
(1)
Post in Ring Interconnect Using for 3-D Stacking
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 20, 2001
From: ROETERS, GLEN E.; MANTZ, FRANK E.
To: DENSE-PAC MICROSYSTEMS
Reel/Frame 012196/0681 →
Change of Name
Jan 26, 2010
From: STAKTEK GROUP, L.P.
To: ENTORIAN TECHNOLOGIES L.P.
Reel/Frame 023848/0062 →
Merger
Oct 25, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029195/0048 →
Merger
Oct 25, 2012
From: ENTORIAN GP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029195/0114 →
Assignment of Assignor's Interest
Dec 2, 2012
From: ENTORIAN TECHNOLOGIES INC.
To: OVID DATA CO. LLC
Reel/Frame 029389/0672 →
Change of Name
Dec 2, 2012
From: DENSE-PAC MICROSYSTEMS, INC.
To: DPAC TECHNOLOGIES CORP.
Reel/Frame 029395/0945 →
Merger
Dec 27, 2015
From: OVID DATA CO. LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037373/0481 →