IP Library › Assignment 012331/0426
Patent Assignment
Reel/Frame 012331/0426

Assignment of Assignor's Interest

Recorded: 2001-11-26 Pages: 5
Assignors
LOPATIN, SERGEY D.
Executed: 2001-11-14
BESSER, PAUL R.
Executed: 2001-11-14
WANG, PIN-CHIN CONNIE
Executed: 2001-11-15
Assignee
ADVANCED MICRO DEVICES, INC.
1160 KERN AVENUE, SUNNYVALE, CALIFORNIA, 94085
Covered Property (1)
Method of Using Ternary Copper Alloy to Obtain a Low Resistance and Large Grain Size Interconnect
Patent: 7,696,092 →
Application: 09/994,395 →
Publication: US 2004/0005773
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Affirmation of Patent Assignment Aug 18, 2009
From: ADVANCED MICRO DEVICES, INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 023120/0426 →
Security Agreement Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Assignment of Assignor's Interest Nov 2, 2020
From: GLOBALFOUNDRIES INC.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 054633/0001 →
Release of Security Interest Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →
Release of Security Interest May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →