Patent Assignment
Reel/Frame 012405/0886
Assignment of Assignor's Interest
Recorded: 2001-12-19
Pages: 2
Assignor
OHNO, TSUYOSHI
Executed: 2001-12-05
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Flip Chip Semiconductor Device Having Signal Pads Arranged Outside of Power Supply Pads
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrected Recordation Form Cover Sheet to Correct to Correct Filing Date, Previously Recorded at Reel/Frame 012405/0886 (Assignment of Assignor's Interest)
May 21, 2002
From: OHNO, TSUYOSHI
To: NEC CORPORATION
Reel/Frame 012964/0537 →
Corrective Assignment to Correct the Execution Date Previously Recorded on Reel 012964, Frame 0537. Assignor Hereby Confirms the Assignment of the Entire Interest.
Sep 24, 2002
From: OHNO, TSUYOSHI
To: NEC CORPORATION
Reel/Frame 013368/0359 →
Assignment of Assignor's Interest
Feb 19, 2003
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013745/0188 →
Change of Name
Dec 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025486/0592 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →