Patent Assignment
Reel/Frame 012432/0114
Assignment of Assignor's Interest
Recorded: 2001-12-28
Pages: 4
Assignee
HYNIX SEMICONDUCTOR, INC.
BUBAL-EBU, ICH'ON, SAN 136-1, AMI-RI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming a Contact Plug for a Semiconductor Device
Patent:
6,472,303 →
Application:
10/034,242 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 16, 2011
From: HYNIX SEMICONDUCTOR INC.
To: 658868 N.B. INC.
Reel/Frame 027233/0886 →
U.S. Intellectual Property Security Agreement (for Non-U.S. Grantors) - Short Form
Jan 10, 2012
From: 658276 N.B. LTD.; 658868 N.B. INC.; MOSAID TECHNOLOGIES INCORPORATED
To: ROYAL BANK OF CANADA
Reel/Frame 027512/0196 →
Change of Name
Mar 13, 2014
From: 658868 N.B. INC.
To: CONVERSANT IP N.B. 868 INC.
Reel/Frame 032439/0547 →
Release of Security Interest
Aug 7, 2014
From: ROYAL BANK OF CANADA
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.; CONVERSANT IP N.B. 868 INC.; CONVERSANT IP N.B. 276 INC.
Reel/Frame 033484/0344 →
U.S. Patent Security Agreement (for Non-U.S. Grantors)
Sep 9, 2014
From: CONVERSANT IP N.B. 868 INC.
To: CPPIB CREDIT INVESTMENTS INC., AS LENDER; ROYAL BANK OF CANADA, AS LENDER
Reel/Frame 033707/0001 →
Release of U.S. Patent Agreement (for Non-U.S. Grantors)
Oct 12, 2018
From: ROYAL BANK OF CANADA, AS LENDER
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 047645/0424 →