Patent Assignment
Reel/Frame 012499/0602
Assignment of Assignor's Interest
Recorded: 2002-01-16
Pages: 3
Assignors
INAGAWA, HIROSHI
Executed: 2001-11-07
MACHIDA, NOBUO
Executed: 2001-11-07
OISHI, KENTARO
Executed: 2001-11-07
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA TOKYO, JAPAN
HITACHI TOBU SEMICONDUCTOR LTD.
TAKASAKI-SHI, 1-1, NISHIYOKOTE-MACHI, GUNMA, JAPAN
Covered Property
(1)
Insulated Gate Type Semiconductor Device and Method for Fabricating the Same
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 11, 2003
From: HITACHI LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014190/0062 →
Merger
Jun 10, 2011
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 026467/0252 →
Change of Name
Jun 10, 2011
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026467/0279 →
Change of Name
Aug 7, 2013
From: HITACHI TOBU SEMICONDUCTOR LTD.
To: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 030964/0735 →
Merger
Mar 24, 2017
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 041731/0587 →
Merger and Change of Name
Mar 24, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.; RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042086/0581 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →