IP Library Assignment 012714/0126
Patent Assignment
Reel/Frame 012714/0126

Assignment of Assignor's Interest

Recorded: 2002-03-08 Pages: 8
Assignors
MOLLA, JAYNAL A.
Executed: 2002-03-06
D'URSO, JOHN
Executed: 2002-03-06
KYLER, KELLY
Executed: 2002-03-01
ENGEL, BRADLEY N.
Executed: 2002-03-04
GRYNKEWICK, GREGORY W.
Executed: 2002-03-01
RIZZO, NICHOLAS
Executed: 2002-03-05
Assignee
MOTOROLA, INC.
1303 EAST ALGONQUIN ROAD, SCHAUMBURG, ILLINOIS, 60196
Covered Property (1)
Method of Applying Cladding Material on Conductive Lines of Mram Devices
Patent: 6,927,072 →
Application: 10/093,909 →
Publication: US 2003/0170976
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 7, 2004
From: MOTOROLA, INC
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 015360/0718 →
Security Agreement Feb 2, 2007
From: FREESCALE SEMICONDUCTOR, INC.; FREESCALE ACQUISITION CORPORATION; FREESCALE ACQUISITION HOLDINGS CORP.; FREESCALE HOLDINGS (BERMUDA) III, LTD.
To: CITIBANK, N.A. AS COLLATERAL AGENT
Reel/Frame 018855/0129 →
Assignment of Assignor's Interest Apr 24, 2009
From: FREESCALE SEMICONDUCTOR, INC.
To: EVERSPIN TECHNOLOGIES, INC.
Reel/Frame 022597/0062 →
Release of Security Interest Jul 30, 2010
From: CITIBANK, N.A.
To: EVERSPIN TECHNOLOGIES, INC.
Reel/Frame 024767/0398 →
Patent Release Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0225 →