IP Library Assignment 012794/0354
Patent Assignment
Reel/Frame 012794/0354

Assignment of Assignor's Interest

Recorded: 2002-04-11 Pages: 3
Assignors
APODACA, MAC
Executed: 2002-03-28
LEE, JON-WON S.
Executed: 2002-03-28
CHANG, KUO-WEI
Executed: 2002-03-28
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Adhesion Layer for a Polymer Memory Device and Method Therefor
Patent: 6,885,021 →
Application: 10/036,833 →
Publication: US 2003/0122170
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 14, 2003
From: INTEL CORPORATION
To: OVONYX, INC.
Reel/Frame 013653/0008 →
Assignment of Assignor's Interest Dec 8, 2015
From: OVONYX, INC.
To: CARLOW INNOVATIONS LLC
Reel/Frame 037244/0954 →
Change of Name Jul 18, 2016
From: CARLOW INNOVATIONS, LLC
To: OVONYX MEMORY TECHNOLOGY, LLC
Reel/Frame 039379/0077 →