IP Library › Assignment 012864/0724
Patent Assignment
Reel/Frame 012864/0724

Assignment of Assignor's Interest

Recorded: 2002-04-30 Pages: 2
Assignor
Assignee
KONINKLIJKE PHILIPS ELECTRONICS N.V.
GROENEWOUDSEWEG 1, EINDHOVEN, 5621, NETHERLANDS
Covered Property (1)
Method of Improving Adhesion of Cap Oxide to Nanoporous Silica for Integrated Circuit Fabrication
Patent: 6,418,875 →
Application: 09/902,062 →
Related Assignments (7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 20, 2006
From: PHILIPS ELECTRONICS NORTH AMERICA CORP.
To: NXP B.V.
Reel/Frame 018654/0521 →
Security Agreement Jan 22, 2007
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 018806/0201 →
Change of Name Oct 28, 2011
From: VLSI TECHNOLOGY, INC.
To: PHILIPS SEMICONDUCTORS VLSI INC.
Reel/Frame 027138/0676 →
Change of Name Oct 28, 2011
From: PHILIPS SEMICONDUCTORS VLSI INC.
To: PHILIPS SEMICONDUCTORS INC.
Reel/Frame 027138/0715 →
Assignment of Assignor's Interest Oct 28, 2011
From: ANNAPRAGADA, RAO VENKATESWARA
To: VLSI TECHNOLOGY, INC.
Reel/Frame 027138/0605 →
Nunc Pro Tunc Assignment Nov 7, 2011
From: PHILIPS SEMICONDUCTORS INC.
To: PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
Reel/Frame 027185/0598 →
Release of Security Interest Sep 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC
To: NXP B.V.
Reel/Frame 050315/0443 →