Patent Assignment
Reel/Frame 027138/0715
Change of Name
Recorded: 2011-10-28
Pages: 5
Assignor
PHILIPS SEMICONDUCTORS VLSI INC.
Executed: 1999-12-20
Assignee
PHILIPS SEMICONDUCTORS INC.
1251 AVENUE OF THE AMERICAS, NEW YORK, NEW YORK, 10020
Covered Property
(1)
Method of Improving Adhesion of Cap Oxide to Nanoporous Silica for Integrated Circuit Fabrication
Patent:
6,418,875 →
Application:
09/902,062 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 30, 2002
From: PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 012864/0724 →
Assignment of Assignor's Interest
Dec 20, 2006
From: PHILIPS ELECTRONICS NORTH AMERICA CORP.
To: NXP B.V.
Reel/Frame 018654/0521 →
Security Agreement
Jan 22, 2007
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 018806/0201 →
Assignment of Assignor's Interest
Oct 28, 2011
From: ANNAPRAGADA, RAO VENKATESWARA
To: VLSI TECHNOLOGY, INC.
Reel/Frame 027138/0605 →
Change of Name
Oct 28, 2011
From: VLSI TECHNOLOGY, INC.
To: PHILIPS SEMICONDUCTORS VLSI INC.
Reel/Frame 027138/0676 →
Nunc Pro Tunc Assignment
Nov 7, 2011
From: PHILIPS SEMICONDUCTORS INC.
To: PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
Reel/Frame 027185/0598 →
Release of Security Interest
Sep 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC
To: NXP B.V.
Reel/Frame 050315/0443 →