Patent Assignment
Reel/Frame 027185/0598
Nunc Pro Tunc Assignment
Recorded: 2011-11-07
Pages: 3
Assignor
PHILIPS SEMICONDUCTORS INC.
Executed: 2011-11-07
Assignee
PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
3000 MINUTEMAN ROAD, ANDOVER, MASSACHUSETTS, 01810
Covered Property
(1)
Method of Improving Adhesion of Cap Oxide to Nanoporous Silica for Integrated Circuit Fabrication
Patent:
6,418,875 →
Application:
09/902,062 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 30, 2002
From: PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 012864/0724 →
Assignment of Assignor's Interest
Dec 20, 2006
From: PHILIPS ELECTRONICS NORTH AMERICA CORP.
To: NXP B.V.
Reel/Frame 018654/0521 →
Security Agreement
Jan 22, 2007
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 018806/0201 →
Change of Name
Oct 28, 2011
From: PHILIPS SEMICONDUCTORS VLSI INC.
To: PHILIPS SEMICONDUCTORS INC.
Reel/Frame 027138/0715 →
Assignment of Assignor's Interest
Oct 28, 2011
From: ANNAPRAGADA, RAO VENKATESWARA
To: VLSI TECHNOLOGY, INC.
Reel/Frame 027138/0605 →
Change of Name
Oct 28, 2011
From: VLSI TECHNOLOGY, INC.
To: PHILIPS SEMICONDUCTORS VLSI INC.
Reel/Frame 027138/0676 →
Release of Security Interest
Sep 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC
To: NXP B.V.
Reel/Frame 050315/0443 →