IP Library › Assignment 012965/0489
Patent Assignment
Reel/Frame 012965/0489

Assignment of Assignor's Interest

Recorded: 2002-06-03 Pages: 2
Assignors
ABE, SHUNICHI
Executed: 2002-03-27
UEBAYASHI, TETSUYA
Executed: 2002-03-28
IZUMI, NAOKI
Executed: 2002-03-27
YAMAZAKI, AKIRA
Executed: 2002-03-27
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI, 2-CHOME CHIYODA-KU, TOKYO, 100-8, JAPAN
Covered Property (1)
Method of Attaching a Semiconductor Chip to a Chip Mounting Substrate
Patent: 7,028,397 →
Application: 10/159,123 →
Publication: US 2003/0059981
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Assignment of Assignor's Interest Apr 7, 2004
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015185/0122 →
Change of Name Sep 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024973/0598 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →