IP Library Assignment 013018/0156
Patent Assignment
Reel/Frame 013018/0156

Assignment of Assignor's Interest

Recorded: 2002-06-18 Pages: 2
Assignors
WENSKI, GUIDO
Executed: 2002-05-22
ALTMANN, THOMAS
Executed: 2002-05-27
HEIER, GERHARD
Executed: 2002-05-22
WINKLER, WOLFGANG
Executed: 2002-05-22
KANN, GUNTHER
Executed: 2002-05-29
Assignee
WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG
JOHANNES-HESS-STRASSE 24, 84489 BURGHAUSEN, GERMANY
Covered Property (1)
Process for Material-Removing Machining of Both Sides of Semiconductor Wafers
Patent: 6,793,837 →
Application: 10/174,139 →
Publication: US 2003/0054650
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jul 30, 2004
From: WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AKTIENGESELLSCHAFT
To: SILTRONIC AG
Reel/Frame 015596/0720 →
Change of Address Jun 30, 2021
From: SILTRONIC AG
To: SILTRONIC AG
Reel/Frame 056719/0881 →
Corrective Assignment to Correct the Date of the Change of Address from 03/12/2020 to 12/03/2020 Previously Recorded at Reel: 056719 Frame: 0881. Assignor(S) Hereby Confirms the Assignment. Jul 1, 2021
From: SILTRONIC AG
To: SILTRONIC AG
Reel/Frame 057561/0451 →