Patent Assignment
Reel/Frame 013065/0642
Assignment of Assignor's Interest
Recorded: 2002-07-08
Pages: 2
Assignor
KUO, FRANK
Executed: 2002-06-10
Assignee
SILICONIX TAIWAN LTD.
NO. 3-3, EAST 2ND STREET, NAN-TZU EXPORT PROCESSING ZONE, KAOHSIUNG CITY, R.O.C, TAIWAN
Covered Property
(1)
Encapsulation Method and Leadframe for Leadless Semiconductor Packages
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jan 21, 2011
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025675/0001 →
Security Interest
Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
Release of Security Interest
Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED
Reel/Frame 049826/0312 →