Patent Assignment
Reel/Frame 013093/0969
Assignment of Assignor's Interest
Recorded: 2002-07-11
Pages: 3
Assignors
MATSUMOTO, TAKUJI
Executed: 2002-06-18
SAYAMA, HIROKAZU
Executed: 2002-06-18
MAEDA, SHIGENOBU
Executed: 2002-06-18
IWAMATSU, TOSHIAKI
Executed: 2002-06-18
OTA, KAZUNOBU
Executed: 2002-06-18
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JAPAN
Covered Property
(1)
Semiconductor Device Having Offset Insulation Film Formed on Insulation Film, and Method of Manufacturing the Same
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Assignment of Assignor's Interest
Apr 7, 2004
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015185/0122 →
Change of Name
Sep 1, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024915/0526 →
Merger
Sep 1, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024915/0556 →
Assignment of Assignor's Interest
May 13, 2014
From: RENESAS ELECTRONICS CORPORATION
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 032892/0212 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →