Patent Assignment
Reel/Frame 013238/0387
Assignment of Assignor's Interest
Recorded: 2002-08-28
Pages: 2
Assignor
YAMAMOTO, ICHIRO
Executed: 2002-08-15
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Having Smooth Refractory Metal Silicide Layers and Process for Fabrication Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 25, 2003
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013882/0640 →
Change of Name
Dec 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025486/0561 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →