Patent Assignment
Reel/Frame 013321/0449
Re-Record to Correct the Name of the First Assignee, Previously Recorded on Reel 012048 Frame 0502.
Recorded: 2002-09-19
Pages: 3
Assignees
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JAPAN
RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
4-1, MIZUHARA, ITAMI-SHI, HYOGO 664-0005, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same
Related Assignments
(9)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 27, 2001
From: NAKAZAWA, SHOICHIRO; KOBAYASHI, HEIJI
To: MITSUBSIHI DENKI KABUSHIKI KAISHA; RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
Reel/Frame 012048/0502 →
Assignment of Assignor's Interest
Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Assignment of Assignor's Interest
Apr 7, 2004
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015185/0122 →
Change of Name
Sep 10, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024973/0001 →
Merger and Change of Name
Mar 14, 2017
From: RENESAS NAKA SEMICONDUCTOR, INC.; RENESAS KANSAI SEMICONDUCTOR CO., LTD.
To: RENESAS SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 042009/0176 →
Assignment of Assignor's Interest
Mar 14, 2017
From: RENESAS SEMICONDUCTOR MANUFACTURING CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 041573/0973 →
Merger
Mar 14, 2017
From: RENESAS SEMICONDUCTOR ENGINEERING CORPORATION
To: RENESAS NAKA SEMICONDUCTOR, INC.
Reel/Frame 041573/0824 →
Change of Name
Mar 14, 2017
From: RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
To: RENESAS SEMICONDUCTOR ENGINEERING CORPORATION
Reel/Frame 041573/0737 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →