Patent Assignment
Reel/Frame 013376/0168
Assignment of Assignor's Interest
Recorded: 2002-10-08
Pages: 3
Assignors
CHUNG, CHEE KEY
Executed: 2002-10-05
CHAN, SOOK CHIEN
Executed: 2002-10-05
LEONG, KUM FOO
Executed: 2002-10-05
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Apparatus and Methods for Interconnecting Components to via-in-Pad Interconnects
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.