IP Library › Assignment 028362/0802
Patent Assignment
Reel/Frame 028362/0802

Assignment of Assignor's Interest

Recorded: 2012-06-12 Pages: 62
Assignor
NUMONYX B.V.
Executed: 2011-11-22
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, BOISE, IDAHO, 83707
Covered Properties (6)
Apparatus and Methods for Interconnecting Components to via-in-Pad Interconnects
Patent: 6,828,512 →
Application: 10/267,158 →
Publication: US 2004/0064942
Surface Mount Technology to via-in-Pad Interconnections
Patent: 6,927,346 →
Application: 10/326,901 →
Publication: US 2004/0118606
Front Side Hot-Swap Chassis Management Module
Patent: 7,173,817 →
Application: 10/748,385 →
Publication: US 2005/0068722
Compliant Multi-Composition Interconnects
Patent: 7,400,041 →
Application: 10/832,178 →
Publication: US 2005/0239275
Ground Plane for Integrated Circuit Package
Patent: 7,154,175 →
Application: 10/873,817 →
Publication: US 2005/0280138
Method and Apparatus for Reducing Electrical Interconnection Fatigue
Patent: 7,642,660 →
Application: 11/616,164 →
Publication: US 2007/0102817
Related Assignments (13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 8, 2002
From: CHUNG, CHEE KEY; CHAN, SOOK CHIEN; LEONG, KUM FOO
To: INTEL CORPORATION
Reel/Frame 013376/0168 →
Assignment of Assignor's Interest Apr 15, 2003
From: MCCORMICK, CAROLYN R.; DISHONGH, TERRANCE J.
To: INTEL CORPORATION
Reel/Frame 013965/0517 →
Assignment of Assignor's Interest Dec 29, 2003
From: WEI, WEN
To: INTEL CORPORATION
Reel/Frame 014860/0280 →
Assignment of Assignor's Interest Apr 26, 2004
From: MUTHUKUMAR, SRIRAM; DORY, THOMAS S.
To: INTEL CORPORATION
Reel/Frame 015276/0447 →
Assignment of Assignor's Interest Jun 21, 2004
From: SHRIVASTAVA, UDY A.; FRUTSCHY, KRISTOPHER
To: INTEL CORPORATION
Reel/Frame 015511/0004 →
Assignment of Assignor's Interest Oct 24, 2012
From: INTEL CORPORATION
To: MICRON TECHNOLOGY, INC.
Reel/Frame 029185/0623 →
Security Interest May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Patent Security Agreement Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
Corrective Assignment to Correct the Replace Erroneously Filed Patent #7358718 with the Correct Patent #7358178 Previously Recorded on Reel 038669 Frame 0001. Assignor(S) Hereby Confirms the Security Interest. Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
Release of Security Interest Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →