IP Library Granted Patent US 7,173,817
Granted Patent B2
US 7,173,817 · App. 10/748,385 · Granted Feb 6, 2007

Front side hot-swap chassis management module

Assignee: Intel Corporation
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Quick Facts
Patent No.
US 7,173,817
App. No.
10/748,385
Granted
Feb 6, 2007
Kind
B2
Abstract

A modular platform is provided. The modular platform includes a chassis having a front side and a back side, and configured to receive modular platform boards, a plenum associated with the chassis and at least one chassis management module removably disposed in the at least one plenum in a substantially parallel relationship with a flow of a cooling medium passing through the plenum.

Claims (18)

1. A modular platform, comprising:

a chassis having a front side and a back side, and configured to receive modular platform boards;

a plenum associated with the chassis; and

at least one chassis management module designed to at least partially control and at least partially ensure proper operation of the modular platform boards and to be removably disposed in the at least one plenum in a substantially parallel relationship with a flow of a cooling medium passing through the plenum; and

wherein the plenum is a dual plenum and the chassis management module is positioned substantially vertical in the dual plenum.

2. The modular platform of claim 1 , wherein the dual plenum includes two or more fan modules that are independently removable from the plenum.

3. The modular platform of claim 2 , wherein the chassis management module is vertically positioned about an outer edge of at least one of the fan modules, and independently removable from the at least one fan module.

4. The modular platform of claim 2 , wherein the chassis management module is vertically positioned between at least two fan modules, and independently removable from the at least two fan modules.

5. A system comprising,

a rack; and

a plurality of modular platforms mounted in the rack, at least one of the modular platforms including

a chassis having a front side and a back side, and configured to receive modular platform boards,

a plenum associated with the chassis, and

at least one chassis management module designed to at least partially control and at least partially ensure proper operation of the modular platform boards and to be removably disposed in the at least one plenum in a substantially parallel relationship with a flow of a cooling medium passing through the plenum; and

wherein the plenum is a dual plenum and the chassis management module is positioned substantially vertical in the dual plenum.

6. The system of claim 5 , wherein the dual plenum includes two or more fan modules that are independently removable from the plenum.

7. The system of claim 6 , wherein the chassis management module is vertically positioned about an outer edge of at least one of the fan modules, and independently removable from the at least one fan module.

8. The system of claim 6 , wherein the chassis management module is vertically positioned between at least two fan modules, and independently removable from the at least two fan modules.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 24, 2012
From: INTEL CORPORATION
To: MICRON TECHNOLOGY, INC.
Reel/Frame 029185/0623 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 12, 2012
From: NUMONYX B.V.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 028362/0802 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2003
From: WEI, WEN
To: INTEL CORPORATION
Reel/Frame 014860/0280 →
Continuity (2)
Provisional Application 6050721900 · Sep 29, 2003
Related Publication 20050068722A1 · Mar 31, 2005