Patent Assignment
Reel/Frame 029185/0623
Assignment of Assignor's Interest
Recorded: 2012-10-24
Pages: 55
Assignor
INTEL CORPORATION
Executed: 2008-03-25
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, BOISE, IDAHO, 83707
Covered Properties
(5)
Surface Mount Technology to via-in-Pad Interconnections
Front Side Hot-Swap Chassis Management Module
Compliant Multi-Composition Interconnects
Ground Plane for Integrated Circuit Package
Method and Apparatus for Reducing Electrical Interconnection Fatigue
Related Assignments
(12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 15, 2003
From: MCCORMICK, CAROLYN R.; DISHONGH, TERRANCE J.
To: INTEL CORPORATION
Reel/Frame 013965/0517 →
Assignment of Assignor's Interest
Dec 29, 2003
From: WEI, WEN
To: INTEL CORPORATION
Reel/Frame 014860/0280 →
Assignment of Assignor's Interest
Apr 26, 2004
From: MUTHUKUMAR, SRIRAM; DORY, THOMAS S.
To: INTEL CORPORATION
Reel/Frame 015276/0447 →
Assignment of Assignor's Interest
Jun 21, 2004
From: SHRIVASTAVA, UDY A.; FRUTSCHY, KRISTOPHER
To: INTEL CORPORATION
Reel/Frame 015511/0004 →
Assignment of Assignor's Interest
Jun 12, 2012
From: NUMONYX B.V.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 028362/0802 →
Security Interest
May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Patent Security Agreement
Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
Corrective Assignment to Correct the Replace Erroneously Filed Patent #7358718 with the Correct Patent #7358178 Previously Recorded on Reel 038669 Frame 0001. Assignor(S) Hereby Confirms the Security Interest.
Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
Release of Security Interest
Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →