IP Library Assignment 013395/0556
Patent Assignment
Reel/Frame 013395/0556

Corrective Assignment to Correct the First Names of All Assignors and to Correct the Eight Assignor. Document Previously Recorded at Reel 011890 Frame 0742

Recorded: 2002-10-17 Pages: 4
Assignors
YAMAGUCHI, YOSHIHIDE
Executed: 2001-06-01
TENMEI, HIROYUKI
Executed: 2001-05-17
INOUE, KOSUKE
Executed: 2001-05-21
OROKU, NORIYUKI
Executed: 2001-05-21
HOZOJI, HIROSHI
Executed: 2001-05-15
TSUNODA, SHIGEHARU
Executed: 2001-05-17
KANDA, NAOYA
Executed: 2001-05-17
MINAGAWA, MADOKA
Executed: 2001-05-28
ANJO, ICHIRO
Executed: 2001-05-25
NISHIMURA, ASAO
Executed: 2001-05-18
UJIIE, KENJI
Executed: 2001-05-18
YAJIMA, AKIRA
Executed: 2001-05-15
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Device and Method for Manufacturing the Same and Semiconductor Device-Mounted Structure
Patent: 6,930,388 →
Application: 09/811,401 →
Publication: US 2002/0063332
Related Assignments (7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 13, 2001
From: YAMAGUCHI, Y.; TENMEI, H.; INOUE, K.; OROKU, N.
To: HITACHI, LTD.
Reel/Frame 011890/0742 →
Assignment of Assignor's Interest Sep 26, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014569/0585 →
Merger/Change of Name Aug 31, 2011
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026837/0505 →
Assignment of Assignor's Interest May 13, 2014
From: RENESAS ELECTRONICS CORPORATION
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 032892/0212 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →