Patent Assignment
Reel/Frame 013452/0064
Assignment of Assignor's Interest
Recorded: 2002-11-01
Pages: 3
Assignors
PAEK, JONG SIK
Executed: 2002-10-25
PARK, IN BAE
Executed: 2002-10-25
SEO, SEONG MIN
Executed: 2002-10-25
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248
Covered Property
(1)
Wafer-Level Chip-Scale Package
Patent:
6,841,874 →
Application:
10/285,978 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →