Patent Assignment
Reel/Frame 013479/0462
Assignment of Assignor's Interest
Recorded: 2002-11-13
Pages: 6
Assignors
SLATER, DAVID B. JR.
Executed: 2002-09-03
EDMOND, JOHN
Executed: 2002-09-17
NEGLEY, GERALD H.
Executed: 2002-08-30
ANDREWS, PETER S.
Executed: 2002-09-17
Assignee
CREE, INC.
4600 SILICON DRIVE, DURHAM, NORTH CAROLINA, 27703
Covered Property
(1)
Flip-Chip Bonding of Light Emitting Devices and Light Emitting Devices Suitable for Flip-Chip Bonding
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 13, 2002
From: MOHAMMED, ANWAR
To: CREE MICROWAVE, INC.
Reel/Frame 013476/0637 →
Assignment of Assignor's Interest
Nov 13, 2002
From: BHARATHAN, JAYESH; RAFFETTO, MARK
To: CREE LIGHTING COMPANY
Reel/Frame 013479/0468 →
Assignment of Assignor's Interest
Aug 15, 2003
From: CREE LIGHTING COMPANY
To: CREE, INC.
Reel/Frame 014386/0286 →
Conversion of Corporation to Limited Liability Company
Aug 9, 2005
From: CREE MICROWAVE, INC.
To: CREE MICROWAVE, LLC
Reel/Frame 016624/0147 →
Assignment of Assignor's Interest
Apr 1, 2021
From: CREE, INC.
To: CREE LED, INC.
Reel/Frame 056012/0200 →
Security Interest
Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Patent Security Interest Recorded at R/F 058983/0001
Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
Corrective Assignment to Correct the Name of the Assignee Previously Recorded on Reel 56012 Frame 200. Assignor(S) Hereby Confirms the Assignment.
Jul 9, 2025
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 071874/0001 →